MecMill Precision
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This equipment is primarily used for high-precision double-sided grinding and polishing of sapphire, blue glass, ceramic sheets, crystals, semiconductors, and other hard and brittle materials.
| Item | Specification | Parameter |
|---|---|---|
| Lower Plate | Size (Grinding) | Φ1252mm × Φ708mm × 90mm |
| Rotational Speed | 5-70 rpm | |
| Drive Motor | 15kW AC380V 50Hz | |
| Upper Plate | Size (Polishing) | Φ1260mm × Φ700mm × 90mm |
| Pressure | Maximum 1000kg | |
| Satellite Gear | Quantity | 9 pieces |
| Precision | Plate Flatness | ≤0.02mm |
| End Jump | ≤0.03mm | |
| Processing Range | Max Size | Φ280mm |
| Min Thickness | 0.20mm (≤2" wafer) | |
| Dimensions | L × W × H | 2100mm × 1600mm × 3013mm |
We provide comprehensive technical services, technology development, and consulting. Our expertise covers computer software and hardware, sales of functional glass, new optical materials, and specialized equipment for semiconductor devices. We specialize in experimental analysis instruments, CNC machine tools, and high-precision electronic components including photovoltaic equipment and optical glass materials.
